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Chengda Signed Contract with Emei Semi-conductor Material Plant for Engineering Design for 500 TPY Circuit-class Polysilicon Technical Retrofit Project

 

On Dec. 30, 2006, Emei Semi-conductor Material Plant affiliated to Dongfang Steam Turbine Plant and Chengda Engineering Corporation of China officially signed a contract for engineering design of 500TPY Circuit-class Polysilicon Technical Retrofit Project. Attending the signing ceremony were 8-member group from Dongfang Steam Turbine Group including President Cheng Xinyou and Vice President He Xianfu. Attendees from Chengda were Secretary General Wang Xuanzhou, Vice Presidents Wang Lvbei, Lu Zheyu and Wang Yunsheng, etc.

This project adopts home-developed technology, which was jointly developed by Emei Semi-conductor Material Plant and Chengda Engineering Corporation of China. The construction site of this project is Leshan City, Sichuan Province. The total investment is about RMB 600 million. The project is estimated to be put into production in the year 2008.

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(2007/01/08)